Model 170
Ultrasonic Disk Cutter
Quickly cut transmission electron microscope specimens from hard, brittle materials without mechanical or thermal damage.
Ultrasonic disk cutting is a proven method for producing TEM planar or cross-section specimens. Creates disk, cylindrical, and rectangular specimens.
- Disk specimens from materials as thin as 10 μm
- Rods up to 10 mm long
- Rectangular wafers for transmission electron microscopy cross-section specimens
- Precise specimen positioning
- Specimen is always parallel to the cutting axis
- 10 μm resolution depth indicator
- Automatic termination
- Optional microscope attachment
Cutting disk specimens for transmission electron microscopy
Ultrasonic disk cutting is a method for producing transmission electron microscopy specimen disks from any hard, brittle material, such as ceramic, semiconductor, and geological materials. This technique produces either disk specimens from materials as thin as 40 µm or cylindrical rods up to 10 mm in length.
Characterization of small-scale surface topography using transmission electron microscopy
Multi-scale surface topography is critical to surface function, yet the very smallest scales of topography are not accessible with conventional measurement techniques. Here we demonstrate two separate approaches for measuring small-scale topography in a transmission electron microscope (TEM). The first technique...